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May 4, 2026Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Combined control of magnetic and electric fields for enhanced plasma uniformity and compressive residual stress in large-area DC magnetron sputtering

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Authors

HLHyungbin LeeNKN Y KimGAGyuri Ahn

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Overview

Randomized trial demonstrates improved plasma uniformity and compressive stress in large-area DC magnetron sputtering, suggesting better thin-film deposition quality.

Key Points

  • This research aims to enhance plasma uniformity and achieve compressive residual stress in DC magnetron sputtering systems.
  • Combined magnetic and electric-field control applied to plasma deposition.
  • Localized magnetic field confinement by adjusting target-magnet distance and using grounded anode rods.
  • Quantitative analysis of ion density and residual stress based on experimental data and plasma simulations.
  • Achieved transition from tensile stress of +300 MPa to compressive stress of -478 MPa.
  • Enhanced plasma uniformity across the substrate was observed.
  • Uniform compressive stress distribution demonstrated increased control over thin-film properties.

Cite This Study

Lee et al. (2026) studied this question.

synapsesocial.com/papers/69f837233ed186a73998136dhttps://doi.org/10.1116/6.0005396
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