Computational analysis of parameter optimization and manufacture mechanics of LIG flexible electrode

With increasing attention paid to wearable devices and flexible sensing technologies, flexible electronics, as an interdisciplinary field integrating materials science and micro/nano manufacturing, is rapidly entering a stage of application expansion. Laser-induced graphene (LIG) technology is considered one of the potential pathways for graphene preparation for high-performance flexible electronic devices. This study explores the temperature feature and the transformation mechanism of flexible PI films into graphene under CO2 laser irradiation from a multi-scale perspective. A solid heat transfer model was constructed based on the finite element method to dynamically simulate the temperature field distribution on the PI surface during laser scanning. The results show a highly linear positive correlation between temperature and laser energy density. Furthermore, the thermal decomposition evolution of PI in the range of 2800–3400 K was analyzed using molecular dynamics simulations based on a reactive force field. The microscopic simulation results show that the generated LIG possesses a larger specific surface area at higher temperatures, exhibiting the optimal density distribution of hexagonal carbon ring structures when the temperature reaches 3400 K.