The temperature dependence of the edge wetting angle of a solid polycrystalline molybdenum with a copper melt is measured for temperature range 1240–1640°C. It is found that, as the temperature increases within the above range, the edge wetting angle decreases by almost one order of magnitude and the copper layer thickness decreases by a factor of more than five. No chemical interaction and penetration of the copper melt along molybdenum grain boundaries. As the isothermal holding temperature increases, the surface relief of the molten and crystallized copper becomes inhomogeneous and contains portions in the form of plaques.
Kiiko et al. (Thu,) studied this question.