Carbon/polymer composites are increasingly designed as microstructure-engineered multifunctional materials that combine mechanical reinforcement with electrical/thermal transport, electromagnetic interference (EMI) shielding, and sensing. Performance is governed less by filler fraction than by the coupled control of network topology, junction resistance, and interfacial thermal boundary resistance under processing-induced shear and thermal histories. Electrical response follows percolation combined with tunneling/contact-controlled junctions, producing nonlinear σ(φ) behavior and high piezoresistive sensitivity near the percolation threshold. In contrast, thermal transport is commonly limited by Kapitza resistance and filler–filler junction resistance, restricting exploitation of the intrinsic conductivity of CNTs and graphene. Recent advances emphasize hybrid and 3D carbon architectures that densify connectivity, reduce junction losses, and enable programmable anisotropy via scalable routes such as masterbatch extrusion and additive manufacturing. However, translation remains constrained by dispersion-driven variability, transport–toughness trade-offs, and incomplete durability assessment under cycling, humidity, and reprocessing. This review consolidates mechanistic structure–processing–property relationships and provides application-driven design rules for sensors, EMI shielding, and thermal management.
Sharma et al. (Sat,) studied this question.