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May 27, 2026Transactions of Materials Research0 citationsOpen Access

EDM-induced micro/nano-array surface engineering enabling ultrahigh thermal conductivity and excellent mechanical reliability in of Cf/C composite/Haynes 230 alloy dissimilar brazed joints

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PXPengpeng XueXSXiaoqing SiJGJianwei Gao

Key Points

  • This research aims to enhance the thermal and mechanical properties of dissimilar joints between Cf/C composite and Haynes 230 superalloys.
  • Utilized EDM surface engineering to create micro/nano groove arrays on Cf/C composite.
  • Characterized joint properties including thermal conductivity, thermal resistance, and shear strength after thermal cycling.
  • Conducted 200 hours of thermal cycling at high temperatures (600–900 °C).
  • Achieved thermal conductivity values of 42.3–46.6 W·m -1 ·K -1 and thermal resistance as low as 1.59 cm 2 ·K·W -1.
  • Measured shear strength of the joint at 25.4 MPa post-engineering.
  • Demonstrated excellent thermomechanical stability after 200 hours of thermal cycling with no significant performance degradation.

Abstract

: Heterogeneous joining between C f /C composite and Haynes 230 superalloys is critical for aerospace thermal management yet severely limited by interfacial thermal resistance and mechanical reliability. Here we report a one-step EDM surface engineering strategy to construct controllable micro/nano groove arrays on C f /C composite, which simultaneously enhances mechanical interlocking, chemical bonding, and multidimensional heat transfer pathways. The optimized joint (250 μm interval, 90 μm depth) achieves a thermal conductivity of 42.3–46.6 W·m -1 ·K -1 and thermal resistance as low as 1.59 cm 2 ·K·W -1 , with a shear strength of 25.4 MPa. After 200 h thermal cycling (600–900 °C), the joint retains excellent thermomechanical stability without obvious performance degradation. Mechanism analysis reveals that the macroscopic area expansion and microscopic metal–carbon fiber core–shell thermal bridges synergistically break the thermal barrier at dissimilar interfaces. This study not only provides a scalable solution to the thermomechanical trade-off challenge at heterogeneous material interfaces, but also lays a new methodological foundation for the reliable integration of high-power thermal management components.

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Cite This Study

Xue et al. (2026) studied this question.

synapsesocial.com/papers/6a168ac80c924ddd1bd598dahttps://doi.org/10.1016/j.tramat.2026.100308
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