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May 29, 2026Analysis & Sensing0 citations

Fiber‐Based Stretchable Electrodes via Spinning Technologies: Materials Design, Structural Engineering, and Emerging Applications in Wearable Electronics

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YZYuchen ZhangXLXiang LiDZDanyu Zhang

Key Points

  • This review examines how spinning technologies influence the design and performance of stretchable electrodes for wearable electronics. It aims to address structural engineering and optimize electromechanical performance.
  • Comprehensive review of spinning technologies and their impact on stretchable electrode materials.
  • Analysis of different material systems, including metallic, liquid metal, carbon-based, and polymeric fibers.
  • Evaluation of structure-property relationships and interface design techniques.
  • Identified critical factors like interface design and strain dissipation for improving electrode performance.
  • Demonstrated that spun fiber architectures enhance breathability and stability compared to traditional thin-film electrodes.
  • Provided insights into future scalable manufacturing and structural durability for wearable applications.

Abstract

The rapid evolution of wearable electronics urgently requires stretchable electrodes combining mechanical compliance, high conductivity, and long‐term biocompatibility. While traditional thin‐film electrodes suffer from inadequate breathability and interfacial instability, spinning‐derived fiber architectures overcome these limitations through porous, 3D interconnected networks that enable efficient strain dissipation. Despite extensive research on conductive fibers, existing literature often lacks a systematic analysis of how spinning technologies govern structural engineering and optimize electromechanical performance. To bridge this gap, this review comprehensively examines spun stretchable electrodes—encompassing metallic, liquid metal, carbon‐based, and polymeric systems—explicitly positioning spinning technology as the vital bridge between material design and device‐level architecture. We deeply analyze the intrinsic structure‐property relationships, emphasizing interface design, shedding/detachment mitigation, and the decoupling of mechanical deformation from electrical conduction. Furthermore, we highlight advanced structural integration and representative sensing applications. Ultimately, by addressing critical challenges such as scalable manufacturing, structural durability, and system‐level integration, this review provides a holistic materials‐to‐device perspective, offering strategic guidance for the future design of high‐performance, breathable, and integrated wearable platforms.

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Cite This Study

Zhang et al. (2026) studied this question.

synapsesocial.com/papers/6a192f07fab5b468c44184dchttps://doi.org/10.1002/anse.70088
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