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May 31, 2026Advanced Materials2 citations

Bimodal Thermoelectric/AIE E‐Skin Decouples Contact‐Area Ambiguity for Concurrent Pain Perception and Injury Mapping

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BHBingchen HuoFKFengxia KuangCDChunyu Du

Key Points

  • The goal is to improve thermal hazard assessment by decoupling temperature from contact area in electronic skins.
  • Developed a dual-modality bilayer e-skin with thermoelectric and AIE layers.
  • Integrated nociceptive response sensing with optical mapping capabilities.
  • Validated performance using a biomimetic robotic reflex system.
  • Achieved over 97% accuracy in temperature recognition.
  • Enabled real-time injury visualization with reliable nociceptive-like sensing.
  • Provided contact-area-independent thermal field mapping.

Abstract

ABSTRACT Thermoreceptive electronic skins face fundamental limitations due to signal ambiguity caused by the contact‐area effect in thermoelectric devices. Since electrical output depends on total heat flux, localized high‐temperature stimuli generate indistinguishable signals from widespread low‐temperature stimuli, leading to unreliable thermal hazard assessment. To address this challenge, we developed a dual‐modality bilayer e‐skin integrating a single‐walled carbon nanotube‐based thermoelectric layer and an aggregation‐induced emission luminogen‐based photoluminescent layer. The bottom thermoelectric layer functions as a fast‐response nociceptor, converting temperature gradients into voltage‐encoded “pain” signals. The top AIE layer provides contact‐area‐independent optical mapping of thermal fields through photoluminescence quenching, enabling direct visual decoupling of temperature from contact area without computational processing. This integrated platform achieves real‐time injury visualization, accurate temperature recognition (>97% accuracy), and reliable nociceptive‐like sensing. Validated by a biomimetic robotic reflex system, the e‐skin offers a robust solution for intelligent safety protection and enhanced human‐machine interaction in dynamic thermal environments.

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Cite This Study

Huo et al. (2026) studied this question.

synapsesocial.com/papers/6a1bd2675783ba022b6fdd4fhttps://doi.org/10.1002/adma.73540
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