Microchannel heat sinks play a crucial role nowadays for the cooling of electronic devices, and the improvement of their thermal efficiency, and building an effective model is the main concern of the researchers. This study analyzes the effects of ionanofluids on a microchannel heat sink. Different configurations and operating conditions, various fluids as HTF, and parameters are analyzed to find an effective microchannel heat sink. Focusing on simulating a new model cone-column with water-droplet-grooved shaped microchannel heat sink (WDGC-MCHS), cone-column MCHS, and regular MCHS are assessed. Various base materials such as aluminium, copper, and stainless steel are being considered. HTF plays a crucial role in this model, which is why different ionanofluids such as 22% Sat ethylammonium nitrate (22% Sat EAN), Dried ethylammonium nitrate (Dried EAN), and Dried propylammonium nitrate (Dried PAN) with 1% boron nitride (BN) are chosen as HTF for different simulations. Moreover, water also plays the HTF role. It is found that aluminium, copper, and stainless steel present increases in Nu values of 700.27%, 726.31%, and 422.46%, while thermal resistance decreases by 87.23%, 87.68%, and 80.01%, and PEF increases by 38.14%, 40.98%, and 15.41%, respectively. Nanoparticle sizes, shape factors, and solid volume fractions also affect the performance of MCHS. The results from different simulations also illustrate that Nu for WDGC-MCHS, cone-column MCHS, and regular MCHS have improvement of 700.27%, 479.10% and 254%, respectively, when Re increases from 20 to 1000, which demonstrates that WDGC-MCHS gives better results with a new material combination compared to the other available microchannel heat sink configurations.
Nasrin et al. (Mon,) studied this question.