High-purity copper features excellent electrical conductivity but generally low mechanical properties. Adding a three-dimensional graphene network as reinforcement to make a copper–graphene metal matrix composite is promising for a wide range of applications with better mechanical performance and functional capabilities. However, direct application in a metal matrix is difficult due to unfavorable wetting, which causes poor dispersion and weak interfacial bonding in the graphene–metal system. Here, the powder metallurgy method was used to construct a three-dimensional continuous graphene network in the copper matrix combined with high-pressure torsion. Optimized deformation/thermomechanical treatment enhanced the microstructural development processed by the severe plastic deformation method of high-pressure torsion. The primary advantage of this hybrid process is that it enables us to achieve grains with a size in the ultra-fine or even nanoscale. A homogeneous equiaxed nanostructure without segregation was observed during microstructural characterization, with a grain size of ~300 nm. This study investigated structural development during progressive deformation, and the samples were evaluated from the viewpoint of grain size and grain boundaries. The process significantly increased the microhardness of the copper–graphene composite. The tensile strength reached ~500 MPa at room temperature. The interpenetrating structural feature of graphene promoted interfacial shear stress to a high level, whereas plastic deformation increased the dislocation density and grain boundaries, thus resulting in significantly enhanced load transfer strengthening and crack-bridging toughness simultaneously.
Dar et al. (Tue,) studied this question.