NewATHENA's X-ray Integral Field Unit (X-IFU) uses a large-format array of Transition Edge Sensor (TES) microcalorimeters coupled with absorbers made of gold and bismuth providing 4 eV FWHM resolution up to 7 keV in the 0.2 12 keV band. X-ray absorbers must be thick enough for photon absorption, maintain low heat capacity for energy resolution, and have good thermalization properties. The X-IFU requires total Quantum Efficiency (QE) of 96%, 87%, and 63% at 1, 7, and 9.5 keV, respectively. Optimal thicknesses are 1.05 ?m gold and 5.5 ?m bismuth to achieve 0.731 pJ/K at 90 mK and 87% QE at 7 keV. While typical TES absorbers are 3-4 ?m thick, producing the required 5.5 ?m Bi absorbers via standard electroplating creates enlarged grains and surface roughness. The increased roughness and grain size variability produced with our standard recipe have resulted in instances of 1) low energy spectral tails 2) spectral broadening of the energy resolution and 3) thermal shorts between pixels when a large grain bridges the gap between absorbers. In this study, we have introduced a new fabrication process and altered the morphology of the thick Bi through changes in the electroplating process. The process changes are intended to address all three issues as well as reduce particulate contamination observed on the finished detector arrays.
Farrahi et al. (2026) studied this question.