March 3, 2026Open Access

LD泵浦镶嵌式Yb:YAG微片激光器的热效应分析

Key Points

The maximum temperature rise in the Yb:YAG microchip reaches 67.75 K under a pump power of 50 W.
Finite element analysis was utilized to assess the temperature field and thermal deformation effects.
Pump power and Gaussian radius were found to significantly influence the thermal behavior within the crystal.
The findings support the theoretical design of high-performance LD pumped Yb:YAG microchip lasers.

Abstract

为了解决激光二极管(laser diode, LD)端面泵浦的微片激光器会在晶体内部发生废热堆积的问题，基于镶嵌式Yb:YAG微片激光晶体的工作特点，建立了侧面与底面始终冷却，泵浦端面与空气热交换的Yb:YAG微片热模型。根据热传导方程，对Yb:YAG微片的温度场、应力场及热形变场使用有限元分析法进行计算，并定量分析了泵浦功率、泵浦半径与高斯阶次对温度场及热形变场的影响。研究结果表明：若以泵浦功率为50 W，泵浦光高斯半径为300 μm的激光二极管对底面半径为3 mm，柱高为0.5 mm，且掺杂浓度为8.0at.%的Yb:YAG微片端面进行泵浦，晶体内部场的最高温升为67.75 K，z轴方向最大热形变量为1.8351×10−4 mm，泵浦端面最大形变量为1.8355×10−4 mm，最大应力为1.249×108 N·m−2。研究结果对激光二极管端面泵浦的Yb:YAG微片激光器的设计提供了理论依据。

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Authors

Xinyang LI

西

西安建筑科技大学应用物理研究所，陕西西安 710055

Long LI

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Journal of Applied Optics

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LD泵浦镶嵌式Yb:YAG微片激光器的热效应分析

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