Fabrication of IC substrates utilizing semi-additive copper deposition and a machine-optimized anode control system

Key Points

• Enhanced quality of IC substrates is achieved through optimized anode control system, leading to better performance.
• Key evidence reveals that this method improves the deposition process, enhancing overall substrate reliability.
• Fabrication techniques utilize semi-additive copper deposition combined with a machine-optimized anode control system.
• Significance highlights the potential for more efficient and cost-effective processes in semiconductor manufacturing.

Abstract