Investigation, modeling and optimization of ECAP parameters for Cu–0.7%Te alloy to enhance mechanical and microstructural properties with minimal impact on electrical conductivity

This study delves into investigating, modeling, and optimizing the Equal Channel Angular Pressing (ECAP) process parameters for Cu–0.7%Te in order to enhance its mechanical and microstructural properties with minimum impact on electrical properties using the Response Surface Methodology (RSM). The ECAP die channel angle (90°–110°), number of passes (4 –12), and processing temperature (25°C–425°C) are chosen to see their critical influence on mechanical (hardness and tensile strength), microstructural, and electrical (conductivity) properties. The experiments are designed as per the RSM face centered design, and the model of each response was prepared. The optimal set of parameters was obtained by the prepared RSM model for maximum mechanical and electrical properties and minimum grain size. The verification test was conducted using the nearest feasible optimized parameters. The obtained result of the verification test is compared with the parent unprocessed sample and discussed in detail using optical, Electron Backscattered Diffraction (EBSD), and Transmission Electron Microscopy (TEM). The verification analysis shows that the obtained results are within the 95% confidence interval of the predicted results of the RSM model, which signifies the accuracy and reliability of the prepared model.